|
|
||||||||||||
|
Abstract The use of SiC MOSFETs in power applicationsallows to increase power density and efficiency because switching frequencies are higher. However, parasitic impedances are responsible for oscillations that can have negative effects. In this paper we analyse the parasitic impedances of a half-bridge formed by a busbar PCB laminated with SiC MOSFETs. Using the distributed parameter approach, we have developed a procedure to characterize the impedance of the switching current loop responsible for the oscillations in the switching. According to the above, the conclusions obtained will be presented. Key words: SiC inverter, parasitic impedance, half-bridge.
References [1] B. Zhang and S. Wang, "A Survey of EMI Research in Power Electronics Systems with Wide-Bandgap Semiconductor Devices," in IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 8, no. 1, pp. 626–643, March 2020. [2] V. Nguyen, L. Kerachev, P. Lefranc and J. Crebier, "Characterization and Analysis of an Innovative Gate Driver and Power Supplies Architecture for HF Power Devices with High dv/dt," in IEEE Transactions on Power Electronics, vol. 32, no. 8, pp. 6079–6090, Aug. 2017. [3] T. Liu, R. Ning, T. T. Y. Wong and Z. J. Shen, "Modeling and Analysis of SiC MOSFET Switching Oscillations," in IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 4, no. 3, pp. 747–756, Sept. 2016. [4] R. S. Krishna Moorthy et al., "Estimation, Minimization, and Validation of Commutation Loop Inductance for a 135-kW SiC EV Traction Inverter," in IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 8, no. 1, pp. 286-297, March 2020, doi: 10.1109/JESTPE.2019.2952884. [5] S. Li, L. M. Tolbert, F. Wang and F. Z. Peng, "Stray Inductance Reduction of Commutation Loop in the P-cell and N-cell-Based IGBT Phase Leg Module," in IEEE Transactions on Power Electronics, vol. 29, no. 7, pp. 3616–3624, July 2014, doi: 10.1109/TPEL.2013.2279258. [6] A. Ruehli, C. Paul and J. Garrett, "Inductance calculations using partial inductances and macromodels,"Proceedings of International Symposium on Electromagnetic Compatibility, Atlanta, GA, USA, 1995, pp. 23–28. [7] A. Domurat-Linde and E. Hoene, "Investigation and PEEC based simulation of radiated emissions produced by power electronic converters," 2010 6th International Conference on Integrated Power Electronics Systems, Nuremberg, 2010, pp. 1–6. [8] Z. Yuan et al., "Design and Evaluation of Laminated Busbar for Three-Level T-Type NPC Power Electronics Building Block with Enhanced Dynamic Current Sharing," in IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 8, no. 1, pp. 395–406, Mar 2020, doi: 10.1109/JESTPE.2019.2947488. [9] Z. Wang, Y. Wu, M. Mahmud, Z. Yuan, Y. Zhao and H. A. Mantooth, "Busbar Design and Optimization for Voltage Overshoot Mitigation of a Silicon Carbide High-Power Three- Phase T-Type Inverter," in IEEE Transactions on Power Electronics, doi: 10.1109/TPEL.2020.2998465. [10] E. Shelton, N. Hari, X. Zhang, T. Zhang, J. Zhang and P. Palmer, "Design and measurement considerations for WBG switching circuits," 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe), Warsaw, 2017, pp. P.1–P.10, doi: 10.23919/EPE17ECCEEurope.2017.8099377. [11] A. Llamazares, M. García-Gracia and S. Martín-Arroyo, "Characterization of Parasitic Impedance in PCB Using a Flexible Test Probe Based on a Curve-Fitting Method," in IEEE Access, vol. 9, pp. 40695-40705, 2021, doi: 10.1109/ACCESS.2021.3064190. [12] Keysight Technologies, Appl. Note 5990-7033, LF-RF Network Analyzer with Option 005 Impedance Analysis Function, pp. 7–12, 2018. [13] M. K. Kazimierczuk, High-frequency magnetic components, 2nd ed., John Wiley & Sons, 2014. [14] S. P. Hall and H. L. Heck, “Nonideal Conductor Models,” in Advanced Signal Integrity for High-Speed Digital Systems, 1st ed., John Wiley & Sons; 2009, doi: 10.1002/9780470423899. [15] T. Liu, T. T. Y. Wong and Z. J. Shen, "A New Characterization Technique for Extracting Parasitic Inductances of SiC Power MOSFETs in Discrete and Module Packages Based on Two-Port S-Parameters Measurement," in IEEE Transactions on Power Electronics, vol. 33, no. 11, pp. 9819–9833, Nov. 2018, doi: 10.1109/TPEL.2017.2789240. |
||||||||||||
![]() |
||||||||||||
![]() |
||||||||||||
|
||||||||||||